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文档中心 > GR5526 Datasheet/ PMU/ Power Consumption/ Electrical Specifications Copy URL

Electrical Specifications

Sleep

表 51 Electrical specifications
Symbol Description Min. Typ. Max. Unit
IUDS,RAMOFF,BODOFF,FLASHOFF,RESET Ultra Deep Sleep, no RAM retention, BOD disabled, Flash powered off, woken up on reset 2.38 μA
IUDS,RAMOFF,BODOFF,FLASHOFF,AON_GPIO Ultra Deep Sleep, no RAM retention, BOD disabled, Flash powered off, woken up on AON GPIO 2.38 μA
IUDS,RAMOFF,BODOFF,FLASHOFF,SLP_TIMER Ultra Deep Sleep, no RAM retention, BOD disabled, Flash powered off, woken up on Sleep Timer 2.39 μA
IUDS,RAMOFF,BODOFF,FLASHOFF,SLP_TIMER_LFRC Ultra Deep Sleep, no RAM retention, BOD disabled, Flash powered off, woken up on Sleep Timer (running from LFXO_32K clock) 2.5 μA
IDP,RAMOFF,ANY Deep Sleep, no RAM retention, woken up on any source 2.5 μA
IDP,RAMON,ANY Deep Sleep, full 512 KB RAM retention, woken up on any source 4.3 μA
IDP,RAMON,BLE Deep Sleep, full 512 KB RAM retention, woken up on Bluetooth LE controller 4.2 μA
IDP,RAMON,BLE_LFRC Deep Sleep, full 512 KB RAM retention, woken up on Bluetooth LE controller (running from LFXO_32K clock) 4.4 μA
IDP,128RAMON,BLE Deep Sleep, full 128 KB RAM retention, woken up on Bluetooth LE controller 3.3 μA
IDP,RAMON,SLP_TIMER Deep Sleep, full 512 KB RAM retention, woken up on Sleep Timer 4.2 μA
IDP,RAMON,COMP Deep Sleep, full 512 KB RAM retention, woken up on LPCOMP 4.2 μA
IDP,RAMON,SLP_TIMER_LFXO Deep Sleep, full 512 KB RAM retention, woken up on Sleep Timer (running from LFXO_32K clock) 4.4 μA
IDP,RAMON,RTC Deep Sleep, full 512 KB RAM retention, woken up on RTC 4.4 μA

CPU Running

表 52 Electrical specifications
Symbol Description Min. Typ. Max. Unit
ICOREMARK,FLASH CPU running CoreMark from Flash 4.9 mA
ICOREMARK,FLASH,HFXO96M CPU running CoreMark from Flash, System Clock = HFXO@96 MHz 5.1 mA
ICOREMARK,FLASH,HFRC16M CPU running CoreMark from Flash, System Clock = HFRC@16 MHz 1.8 mA
ICOREMARK,FLASH,SEC CPU running CoreMark from Flash, Enable security mode 5.0 mA
ICOREMARK,RAM CPU running CoreMark from RAM 4.4 mA
ICOREMARK,RAM_ALIAS CPU running CoreMark from RAM Alias 4.9 mA
ICOREMARK,RAM_ALIAS,HFRC16M CPU running CoreMark from RAM Alias, System Clock = HFRC@16 MHz 1.8
ILOOP,FLASH CPU running while loop from Flash 4.5 mA
ILOOP,FLASH,SEC CPU running while loop from Flash, Enable security mode 4.6 mA
ILOOP,RAM_ALIAS CPU running while loop from RAM Alias 4.7 mA
ILOOP,RAM_ALIAS,HFRC16M CPU running while loop from RAM Alias, System Clock = HFRC@16 MHz 1.7 mA
IIDLE,FLASH CPU idle from Flash 2.4 mA
IIDLE,FLASH,SEC CPU idle from Flash, Enable security mode 2.4 mA
IIDLE,RAM_ALIAS CPU idle from RAM Alias 2.3 mA

Radio Transmitting/Receiving

表 53 Electrical specifications
Symbol Description Min. Typ. Max. Unit
ITRANSMIT,0dBm,1Mbps,HFXO96M Radio transmitting @0 dBm output power, 1 Mbps Bluetooth LE, System Clock = HFXO@96 MHz 4.0 mA
ITRANSMIT,7dBm,1Mbps,HFXO96M Radio transmitting @7 dBm output power, 1 Mbps Bluetooth LE, System Clock = HFXO@96 MHz 7.7 mA
ITRANSMIT,-20dBm,1Mbps,HFXO96M Radio transmitting @-20 dBm output power, 1 Mbps Bluetooth LE, System Clock = HFXO@96 MHz 2.2 mA
ITRANSMIT,0dBm,1Mbps,HFXO16M Radio transmitting @0 dBm output power, 1 Mbps Bluetooth LE, System Clock = HFXO@16 MHz 3.7 mA
IRECEIVE,1Mbps,HFXO96M Radio receiving @ 1 Mbps Bluetooth LE mode, System Clock = HFXO@96 MHz 3.5 mA
IRECEIVE,1Mbps,HFXO16M Radio receiving @ 1 Mbps Bluetooth LE mode, System Clock = HFXO@16 MHz 3.4 mA

PSRAM

表 54 Electrical specification
Symbol Description Min. Typ. Max. Unit
IRUNNING Read/Write @48 MHz 7 mA
IFULL,STANDBY Full array refresh standby current, slow refresh, without CLK toggling 66 μA
I1/2,STANDBY 1/2 array refresh standby current, slow refresh, without CLK toggling 65 μA
I1/4,STANDBY 1/4 array refresh standby current, slow refresh, without CLK toggling 64 μA
I1/8,STANDBY 1/8 array refresh standby current, slow refresh, without CLK toggling 60 μA
IFULL,HS Full array refresh half sleep current, slow refresh, without CLK toggling 20 μA
I1/2,HS 1/2 array refresh half sleep current, slow refresh, without CLK toggling 14 μA
I1/4,HS 1/4 array refresh half sleep current, slow refresh, without CLK toggling 11 μA
I1/8,HS 1/8 array refresh half sleep current, slow refresh, without CLK toggling 10 μA
IDPD Reset values and memory content are not retained in Deep Power Down mode. 7 μA

USB

表 55 Electrical specification
Symbol Description Min. Typ. Max. Unit
IRAMON,RUNNING,USB_ACTIVE Full 512 KB RAM retention, CPU running, USB active mA
IRAMON,SLEEPING,USB_SUSPEND Full 512 KB RAM retention, CPU sleeping, USB suspended μA

ADC Active

表 56 Electrical specification
Symbol Description Min. Typ. Max. Unit
IADC,4KHz,128_POINTS CPU running, ADC sampling@4 kHz sample clock, acquire 128 points mA
IADC,16KHz,128_POINTS CPU running, ADC sampling@16 kHz sample clock, acquire 128 points mA
IADC,1MHz,128_POINTS CPU running, ADC sampling@1 MHz sample clock, acquire 128 points mA
IADC,16MHz,128_POINTS CPU running, ADC sampling@16 MHz sample clock, acquire 128 points mA

TEMP Measure Active

表 57 Electrical specifications
Symbol Description Min. Typ. Max. Unit

ITEMP

TEMP measurement started

mA

VBATL Measure Active

表 58 Electrical specifications
Symbol Description Min. Typ. Max. Unit

IVBATL

VBATL measurement started

mA

COMP Active

表 59 Electrical specifications
Symbol Description Min. Typ. Max. Unit

ICOMP

COMP started

μA

BOD Active

表 60 Electrical specifications
Symbol Description Min. Typ. Max. Unit

IBOD

BOD running

 0.4

μA

TRNG Active

表 61 Electrical specifications
Symbol Description Min. Typ. Max. Unit

ITRNG

TRNG running

μA

Security Active

表 62 Electrical specifications
Symbol Description Min. Typ. Max. Unit

IPRESENT128

Present-128 running in encryption mode

μA

IAES

AES running

μA

IPKC

PKC running

μA

IHMAC

HMAC running

μA

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