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PSRAM

The GR5526VGBIP and GR5526RGNIP SoCs have an 8 MB PSRAM. PSRAM uses OSPI for data access. The OSPI address mapping is used to map PSRAM space to 0x30080000 area, which is helpful for users to access this memory space. Pin definitions are shown in 表 21.

表 21 Pin definitions
Symbol Type Description

VDD

Power

Core supply 1.8 V

VDDQ

Power

IO supply 1.8 V

VSS

Ground

Core supply ground

VSSQ

Ground

IO supply ground

A/DQ[7:0]

IO

Address/DQ bus[7:0]

DQS/DM

IO

DQ Strobe (DQS) clock during reads, data mask during writes. DM (Data Mask) is active high. DM = 1 means “do not write”.

CE#

Input

Chip select, active low. When CE# = 1, chip is in standby state.

CLK

Input

Clock signal

Specifications

  • Single supply voltage:
    • VDD: 1.62 to 1.98 V
    • VDDQ: 1.62 to 1.98 V
  • Interface: OSPI, two bytes transferred per one clock cycle
  • Performance: Only 48 MHz clock rate is supported, up to 70 MB/s read/write throughput
  • Organization: 8 MB with 1024 Bytes page size
  • Refresh: Self-managed
  • Operating temperature range:
    • Tc: -40°C to +85°C (standard range)
  • Maximum standby current:
    • 300 μA @ 105°C
    • 200 μA @ 85°C
    • 100 μA @ 25°C
    • 30 μA @ 25°C (half sleep mode with data retained)

Features

  • Low power features
    • Partial array self-refresh
    • Auto Temperature Compensated Self-Refresh (ATCSR) by built-in temperature sensor
    • User-configurable refresh rate
    • Ultra Low Power (ULP) in half sleep mode with data retained
  • Software reset
  • Output driver LVCMOS with programmable drive strength
  • Data Mask for writing data
  • Data Strobe enables high-speed read operation
  • Register-configurable write and read initial latencies
  • Write burst length with a maximum of 1024 bytes and a minimum of 2 bytes
  • Wrap and hybrid burst in 16 B/32 B/64 B/1 KB lengths
  • Linear burst command
  • Row boundary crossing (RBX)
    • Read operations can be enabled via Mode Register
    • RBX write is not supported

Functional Description

PSRAM is byte-addressable. Memory accesses are required to start on both even and odd addresses, but starting memory access at even addresses is more efficient than starting memory access at odd addresses (example, A[0] = 0). Mode Register accesses allow both even and odd addresses.

The modes of read and write operations are in default Hybrid Wrap 32 mode. Other burst lengths of 16 B, 32 B, 64 B or 1 KB in standard or hybrid wrap modes are configurable by using registers, as shown in the table below. The PSRAM also includes command for linear bursting. Bursts can start on any even address. Write burst length has a minimum of 2 bytes. Read has no minimum length.

表 22 Wrap mode configuration
Register MR8[2] Register MR8[1:0] Burst Length Example of Sequence of Bytes During Wrap
Starting Address Byte Sequence
0b’0 0b’00 16 Byte Wrap 4 [4,5,6,…,15,0,1,2,3,…]
0b’0 0b’01 32 Byte Wrap 4 [4,5,6,…,31,0,1,2,3,…]
0b’0 0b’10 64 Byte Wrap 4 [4,5,6,…,63,0,1,2,3,…]
0b’0 0b’11 1K Byte Wrap 4 [4,5,6,…,1023,0,1,2,3,…]
0b’1 0b’00 16 Byte Hybrid Wrap 2

[2,3,4,…,15,0,1],16,17,…,1023,

0,1,…]

0b’1 0b’01 32 Byte Hybrid Wrap 2

[2,3,4,…,31,0,1],32,33,…,1023,

0,1,…]

0b’1 0b’10 64 Byte Hybrid Wrap 2

[2,3,4,…,63,0,1],64,65,…,1023,

0,1,…]

0b’1 0b’11 1k Byte Hybrid Wrap 2 [2,3,4,…,1023,0,1,2,…]

PSRAM supports the following instructions and follows a certain timing.

表 23 Supported instructions
1st CLK 2nd CLK 3rd CLK

Rising/Falling edge

Rising edge

Falling edge

Rising edge

Falling edge

Command

Instruction

Address[31:24]

Address[23:16]

Address[15:8]

Address[7:0]

Sync Read

00h

A3

A2

A1

A0

Sync Write

80h

A3

A2

A1

A0

Sync Read (Linear Burst)

20h

A3

A2

A1

A0

Sync Write (Linear Burst)

A0h

A3

A2

A1

A0

Mode Register Read

40h

-

-

-

Mode Register Address

Mode Register Write

C0h

-

-

-

Mode Register Address

Global Reset

FFh

-

-

-

-

The PASR bits restrict refresh operations to a portion of the total memory array. This feature allows the device to reduce standby current by refreshing only that part of the memory array required by the host system. The refresh options are full array, one-half array, one-quarter array, one-eighth array, or none of the array. The mapping of these partitions can start at either the beginning or the end of the address map.

表 24 Self refresh zone configuration
Register MR4[2:0] Refresh Coverage Address Space Size

0b’000

Full array (default)

000000h-7FFFFFh

8 MB

0b’001

Bottom 1/2 array

000000h-3FFFFFh

4 MB

0b’010

Bottom 1/4 array

000000h-1FFFFFh

2 MB

0b’011

Bottom 1/8 array

000000h-0FFFFFh

1 MB

0b’100

None

0

0 MB

0b’101

Top 1/2 array

400000h-7FFFFFh

4 MB

0b’110

Top 1/4 array

600000h-7FFFFFh

2 MB

0b’111

Top 1/8 array

700000h-7FFFFFh

1 MB

Half Sleep mode supports putting the device in an ultra-low power state, while the stored data is retained. Half Sleep Mode Entry is entered by writing 0xF0 into Register MR6. CE# going high initiates the Half Sleep mode and must be maintained for the minimum duration of tHS (minimum Half Sleep duration). Half Sleep Exit is initiated by a low-pulsed CE#.

Deep Power Down (DPD) mode supports putting the device into power down state. DPD Entry is entered by writing 0xC0 into Register MR6. CE# going high initiates the DPD mode and must be maintained for the minimum duration of tDPD (minimum Deep Power Down duration). DPD Exit is initiated by a low-pulsed CE#. Register values and memory content are not retained in DPD mode. Afterwards, the DPD mode register values will be reset to defaults. tDPDp is minimum period between two DPD modes (measured from DPD Exit to the next DPD Entry) as well as from the initial power-up to the first DPD Entry.

Registers

MR0

  • Name: Mode Register 0
  • Description: Mode Register
  • Base Address: OSPI_XIP_BASE_ADDRESS
  • Offset: 0x00
  • Reset value: 0x09
表 25 MR0 Register
Bits Field Name RW Reset Description

7:6

FX

RW

0x0

Fixed

5

RD_LT

RW

0x0

Read latency type

Value:

  • 0x0: Variable (default)
  • 0x1: Fixed

4:2

RD_LC

RW

0x2

Read latency code

When MR0[5] = 0, the latency value and max push out value for each bit of MR0[4:2] are listed below.

  • 0x0: 3, 6
  • 0x1: 4, 8
  • 0x2: 5 (default), 10
  • 0x3: 6, 12
  • 0x4: 7, 14
  • Others: None

When MR0[5] = 1, the latency value for each bit of MR0[4:2] is listed below.

  • 0x0: 6
  • 0x1: 8
  • 0x2: 10
  • 0x3: 12
  • 0x4: 14
  • Others: None

The standard/extended Max. Input CLK Freq (MHz) value for each bit of MR0[4:2] is listed below.

  • 0x0: 66
  • 0x1: 109
  • 0x2: 133
  • 0x3: 166
  • 0x4: 200
  • Others: None

1:0

DS

RW

0x1

Drive Strength

Value:

  • 0x0: Full (25 Ω)
  • 0x1: Half (50 Ω, default)
  • 0x2: 1/4 (100 Ω)
  • 0x3: 1/8 (200 Ω)

MR1

  • Name: Mode Register 1
  • Description: Mode Register
  • Base Address: OSPI_XIP_BASE_ADDRESS
  • Offset: 0x01
  • Reset Value: 0x8D
表 26 MR1 Register
Bits Field Name RW Reset Description

7

ULP

R

0x0

Ultra Low Power Device

Value:

  • 0x0: Non-ULP (no Half Sleep)
  • 0x1: ULP (Half Sleep supported)

6:5

RSVD

R

Reserved bits

4:0

VID

R

0x2

Vendor ID

  • 0xD: APM

MR2

  • Name: Mode Register 2
  • Description: Mode Register
  • Base Address: OSPI_XIP_BASE_ADDRESS
  • Offset: 0x02
  • Reset Value: 0x93
表 27 MR2 Register
Bits Field Name RW Reset Description

7

GB

R

0x1

Good-Die

Value:

  • 0x0: Fail
  • 0x1: Pass

6:5

RSVD

R

Reserved bits

4:3

DID

R

0x2

Device ID

  • 0x0: Generation 1
  • 0x1: Generation 2
  • 0x2: Generation 3 (default)
  • Others: Reserved

2:0

DEV_D

R

0x3

Device Density

  • 0x1: 4 MB
  • 0x3: 8 MB (default)
  • 0x5: 16 MB
  • 0x7: 32 MB
  • Others: Reserved

MR3

  • Name: Mode Register 3
  • Description: Mode Register
  • Base Address: OSPI_XIP_BASE_ADDRESS
  • Offset: 0x03
  • Reset Value: 0x80
表 28 MR3 Register
Bits Field Name RW Reset Description

7

RBX

R

0x1

Row boundary crossing enable

Value:

  • 0x0: RBX not supported
  • 0x1: RBX supported via MR8[3] = 1

6

VCC

R

0x0

Operating voltage range

Value:

  • 0x0: 1.8 V (default)
  • 0x1: 3 V

5

SRF

R

0x0

Self refresh flag

Value:

  • 0x0: Slow refresh (allowed via MR4[3] = 1, otherwise fast refresh)
  • 0x1: Fast refresh

4:0

RSVD

R

Reserved bits

MR4

  • Name: Mode Register 4
  • Description: Mode Register
  • Base Address: OSPI_XIP_BASE_ADDRESS
  • Offset: 0x04
  • Reset Value: 0x40
表 29 MR4 Register
Bits Field Name RW Reset Description

7:5

WR_L

RW

0x2

Write latency

The values of write latency and Fmax (MHz) for MR4[7:5] are listed below.

  • 0x0: 3, 66
  • 0x4: 4, 104
  • 0x2: 5 (default), 133
  • 0x6: 6, 166
  • 0x1: 7, 200
  • Others: reserved, none

4

FX

RW

0x0

Fixed

3

FLUSH_FREQ

RW

0x0

Refresh Frequency

Value:

  • 0x0: Fast refresh (default)
  • 0x1: Enable slow refresh when temperature allows

2:0

PASR

RW

Partial array self-refresh

Value: Refer to 表 24

MR6

  • Name: Mode Register 6
  • Description: Mode Register
  • Base Address: OSPI_XIP_BASE_ADDRESS
  • Offset: 0x06
  • Reset Value: 0x00
表 30 MR6 Register
Bits Field Name RW Reset Description

7:4

ULP_MODE_SEL

W

0x0

ULP modes selection

  • 0xF: Half Sleep mode
  • 0xC: Deep Power Down mode
  • Others: Reserved

3:0

RSVD

W

Reserved bits

MR8

  • Name: Mode Register 8
  • Description: Mode Register
  • Base Address: OSPI_XIP_BASE_ADDRESS
  • Offset: 0x08
  • Reset Value: 0x00
表 31 MR8 Register
Bits Field Name RW Reset Description

7

FX

RW

0x0

Fixed

6:4

RSVD

R

Reserved bits

3

RBX

RW

0x0

Row Boundary Crossing Read Enable

Value:

  • 0x0: Reads stay within the 1K column address space
  • 0x1: Reads cross row at 1K boundaries

2

BT

RW

0x1

Burst Type.

Value: Refer to 表 22

1:0

BL

RW

0x1

Burst Length

Value: Refer to 表 22

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